Inventor

VAL CHRISTIAN

FR42 patents

⚠️ This page may combine multiple inventors who share the name “VAL CHRISTIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VAL CHRISTIAN

THOMSON CSF

Method for interconnecting semiconductor chips in three dimensions, and component resulting therefrom

Process and device for hermetic encapsulation of electronic components

Device for the 3D encapsulation of semiconductor chips

Method for the 3D interconnection of packages of electronic components, and device obtained by this method

Method and device for interconnecting integrated circuits in three dimensions

3D interconnection process for electronic component packages and resulting 3D components

Method of producing coaxial connections for an electronic component, and component package

Wire bonding method with a frame, for connecting an electronic component for testing and mounting

Device for the protection of an electronic component and/or circuit against the disturbances (voltages) generated by an external electromagnetic field

Thermal printing head

Microbox for electronic circuit and hybrid circuit having such a microbox

Method for the 3D interconnection of packages of electronic components using printed circuit boards

Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding device

Encapsulating case able to resist high external pressures

Step adjustable attenuator

3D PLUS

Process for the collective fabrication of 3D electronic modules

Device for interconnecting, in three dimensions, electronic components

Three dimensional interconnection method and electronic device obtained by same

Electronic device with integrated heat distributor

Process for the collective fabrication of 3D electronic modules

Method for the interconnection of active and passive components and resulting thin heterogeneous component

Method of miniaturized chip on chip interconnection of a 3D electronic module

Process for the wafer-scale fabrication of electronic modules for surface mounting

Process for producing a high-frequency-compatible electronic module

3D electronic module comprising a ball grid array stack

Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz

Method for collective fabrication of 3D electronic modules comprising only validated PCBs

VAL CHRISTIAN

Process for the vertical interconnection of 3D electronic modules by vias

Method for positioning chips during the production of a reconstituted wafer

Method for positioning chips during the production of a reconstituted wafer

Low-thickness electronic module comprising a stack of electronic packages provided with connection balls

Method of interconnecting electronic wafers

Method for producing reconstituted wafers with support of the chips during their encapsulation

3D electronic module

INF MILIT SPATIALE AERONAUT

Electric potential distribution device and an electronic component case incorporating such a device

Electronic component box supplied with a capacitor

Electronic component package comprising a moisture-retention element

Composite substrate with high heat conduction

Radiation-hardened casing for an electronic component

CIMSA SINTRA

Housing for encapsulating an electronic circuit

LAMBERT FRANCOIS

Process for polymerizing thermosetting resins

PACKAGING SIP

Process for the wafer-scale fabrication of hermetic electronic modules