Inventor
PARK JI WOON
KR25 patents
⚠️ This page may combine multiple inventors who share the name “PARK JI WOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
19 patentsUS10991574B2Apr 27, 2021
Methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations73
US11881279B2Jan 23, 2024
Solid state drive device and method for fabricating solid state drive device
SAMSUNG ELECTRONICS CO LTD4 citations72
US10929024B2Feb 23, 2021
Solid state drive devices and storage systems having the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US10402099B2Sep 3, 2019
Solid state drive devices and storage systems having the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US10355073B2Jul 16, 2019
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US9811265B2Nov 7, 2017
Buffer memory devices, memory modules and solid state disks with non-uniform memory device connections
SAMSUNG ELECTRONICS CO LTD4 citations72
US11423950B2Aug 23, 2022
Solid state drive device and method for fabricating solid state drive device
SAMSUNG ELECTRONICS CO LTD2 citations71
US10437766B2Oct 8, 2019
Data storage device including transmission line having open stub and method of operating the same
SAMSUNG ELECTRONICS CO LTD4 citations70
US12074023B2Aug 27, 2024
Methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US11682555B2Jun 20, 2023
Methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US10824580B2Nov 3, 2020
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations62
US9202796B2Dec 1, 2015
Semiconductor package including stacked chips and a redistribution layer (RDL) structure
SAMSUNG ELECTRONICS CO LTD3 citations62
US11670673B2Jun 6, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US10903308B2Jan 26, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US10373831B2Aug 6, 2019
Method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations61
US12361983B2Jul 15, 2025
Storage devices having multi drop structure
SAMSUNG ELECTRONICS CO LTD0 citations60
US11064603B2Jul 13, 2021
Electronic apparatus having package base substrate
SAMSUNG ELECTRONICS CO LTD1 citations59
US10090835B2Oct 2, 2018
On-die termination circuit, a memory device including the on-die termination circuit, and a memory system including the memory device
SAMSUNG ELECTRONICS CO LTD1 citations51
US12020765B2Jun 25, 2024
Non-volatile memory package and storage device comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations47
CHO YOON-KYOUNG
2 patentsUS9488566B2Nov 8, 2016
Centrifugal force-based microfluidic device available for reliability verification, and analyzing method using the same
CHO YOON-KYOUNG0 citations41
US9475048B2Oct 25, 2016
Centrifugal force-based microfluidic device for multiplxed analysis and detection method using the same
CHO YOON-KYOUNG0 citations41