P

Inventor

PARK JI WOON

KR25 patents
⚠️ This page may combine multiple inventors who share the name “PARK JI WOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

19 patents
US10991574B2Apr 27, 2021

Methods of manufacturing semiconductor devices

SAMSUNG ELECTRONICS CO LTD3 citations73
US11881279B2Jan 23, 2024

Solid state drive device and method for fabricating solid state drive device

SAMSUNG ELECTRONICS CO LTD4 citations72
US10929024B2Feb 23, 2021

Solid state drive devices and storage systems having the same

SAMSUNG ELECTRONICS CO LTD3 citations72
US10402099B2Sep 3, 2019

Solid state drive devices and storage systems having the same

SAMSUNG ELECTRONICS CO LTD2 citations72
US10355073B2Jul 16, 2019

Semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations72
US9811265B2Nov 7, 2017

Buffer memory devices, memory modules and solid state disks with non-uniform memory device connections

SAMSUNG ELECTRONICS CO LTD4 citations72
US11423950B2Aug 23, 2022

Solid state drive device and method for fabricating solid state drive device

SAMSUNG ELECTRONICS CO LTD2 citations71
US10437766B2Oct 8, 2019

Data storage device including transmission line having open stub and method of operating the same

SAMSUNG ELECTRONICS CO LTD4 citations70
US12074023B2Aug 27, 2024

Methods of manufacturing semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations62
US11682555B2Jun 20, 2023

Methods of manufacturing semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations62
US10824580B2Nov 3, 2020

Semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations62
US9202796B2Dec 1, 2015

Semiconductor package including stacked chips and a redistribution layer (RDL) structure

SAMSUNG ELECTRONICS CO LTD3 citations62
US11670673B2Jun 6, 2023

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations61
US10903308B2Jan 26, 2021

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations61
US10373831B2Aug 6, 2019

Method of manufacturing semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations61
US12361983B2Jul 15, 2025

Storage devices having multi drop structure

SAMSUNG ELECTRONICS CO LTD0 citations60
US11064603B2Jul 13, 2021

Electronic apparatus having package base substrate

SAMSUNG ELECTRONICS CO LTD1 citations59
US10090835B2Oct 2, 2018

On-die termination circuit, a memory device including the on-die termination circuit, and a memory system including the memory device

SAMSUNG ELECTRONICS CO LTD1 citations51
US12020765B2Jun 25, 2024

Non-volatile memory package and storage device comprising the same

SAMSUNG ELECTRONICS CO LTD0 citations47

CHO YOON-KYOUNG

2 patents

CJ CHEILJEDANG CORP

1 patent

SK HYNIX INC

1 patent

HYUNDAI MOTOR CO LTD

1 patent

PARK JI WOON

1 patent