Inventor
UEHARA AKIRA
JP35 patents
⚠️ This page may combine multiple inventors who share the name “UEHARA AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO OHKA KOGYO CO LTD
21 patentsUS5584647ADec 17, 1996
Object handling devices
TOKYO OHKA KOGYO CO LTD146 citations98
US5083896AJan 28, 1992
Object handling device
TOKYO OHKA KOGYO CO LTD76 citations96
US4318767AMar 9, 1982
Apparatus for the treatment of semiconductor wafers by plasma reaction
TOKYO OHKA KOGYO CO LTD112 citations96
US4208159AJun 17, 1980
Apparatus for the treatment of a wafer by plasma reaction
TOKYO OHKA KOGYO CO LTD70 citations96
US4483651ANov 20, 1984
Automatic apparatus for continuous treatment of leaf materials with gas plasma
TOKYO OHKA KOGYO CO LTD58 citations95
US4245154AJan 13, 1981
Apparatus for treatment with gas plasma
TOKYO OHKA KOGYO CO LTD93 citations95
US5022979AJun 11, 1991
Electrode for use in the treatment of an object in a plasma
TOKYO OHKA KOGYO CO LTD58 citations94
US5006220AApr 9, 1991
Electrode for use in the treatment of an object in a plasma
TOKYO OHKA KOGYO CO LTD89 citations94
US5364488ANov 15, 1994
Coaxial plasma processing apparatus
TOKYO OHKA KOGYO CO LTD47 citations92
US4894254AJan 16, 1990
Method of forming silicone film
TOKYO OHKA KOGYO CO LTD30 citations92
US4336438AJun 22, 1982
Apparatus for automatic semi-batch sheet treatment of semiconductor wafers by plasma reaction
TOKYO OHKA KOGYO CO LTD46 citations91
US4749436AJun 7, 1988
Equipment for thermal stabilization process of photoresist pattern on semiconductor wafer
TOKYO OHKA KOGYO CO LTD23 citations82
US4578559AMar 25, 1986
Plasma etching method
TOKYO OHKA KOGYO CO LTD23 citations82
US4149923AApr 17, 1979
Apparatus for the treatment of wafer materials by plasma reaction
TOKYO OHKA KOGYO CO LTD28 citations82
US4946537AAug 7, 1990
Plasma reactor
TOKYO OHKA KOGYO CO LTD9 citations74
US6436472B1Aug 20, 2002
Method of applying a coating solution to a substrate surface using a rotary coater
TOKYO OHKA KOGYO CO LTD10 citations73
US6067930AMay 30, 2000
Coaxial plasma processing apparatus
TOKYO OHKA KOGYO CO LTD13 citations73
US4868096ASep 19, 1989
Surface treatment of silicone-based coating films
TOKYO OHKA KOGYO CO LTD16 citations73
US5709519AJan 20, 1998
Plasma processing apparatus
TOKYO OHKA KOGYO CO LTD9 citations72
US5344536ASep 6, 1994
Method of and apparatus for processing a workpiece in plasma
TOKYO OHKA KOGYO CO LTD18 citations71
US6761930B2Jul 13, 2004
Method of coating solution on substrate surface using a slit nozzle
TOKYO OHKA KOGYO CO LTD1 citations51
UEHARA AKIRA
5 patentsUS5131524AJul 21, 1992
Conveyor system with movable partitions
UEHARA AKIRA84 citations96
US5137144AAug 11, 1992
Conveyor system
UEHARA AKIRA39 citations92
USD333544SFeb 23, 1993
Conveyor belt
UEHARA AKIRA14 citations73
US4911630AMar 27, 1990
Device for preventing scattering of ejected, molded articles for use in resin molding machine
UEHARA AKIRA8 citations73
US4828477AMay 9, 1989
Device for preventing scattering of molded articles ejected from resin molding machine
UEHARA AKIRA5 citations62
TOKYO DENSHI KAGAKU KK
4 patentsUS4790262ADec 13, 1988
Thin-film coating apparatus
TOKYO DENSHI KAGAKU KK106 citations95
US4577165AMar 18, 1986
High-frequency oscillator with power amplifier and automatic power control
TOKYO DENSHI KAGAKU KK23 citations78
USD291413SAug 18, 1987
Wafer holding frame
TOKYO DENSHI KAGAKU KK11 citations73
US4465553AAug 14, 1984
Method for dry etching of a substrate surface
TOKYO DENSHI KAGAKU KK3 citations62