Inventor

MITCHELL DOUGLAS G

US27 patents

⚠️ This page may combine multiple inventors who share the name “MITCHELL DOUGLAS G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITCHELL DOUGLAS G

MOTOROLA INC

Fine pitch bumping with improved device standoff and bump volume

Interconnect system and method of fabrication

Electrical interconnect and method for forming the same

Metallization scheme providing adhesion and barrier properties

Metallization scheme providing adhesion and barrier properties

Method of manufacturing electronic components

System and method for providing rotation to plating flow

Method of manufacturing a semiconductor component

Method of manufacturing electronic components

Method of manufacturing a semiconductor component and plating tool therefor

FREESCALE SEMICONDUCTOR INC

Semiconductor device packaging

Flip-chip structure and method for high quality inductors and transformers

Through substrate vias for back-side interconnections on very thin semiconductor wafers

Integrated conformal shielding method and process using redistributed chip packaging

Method for controlling warpage in redistributed chip packaging panels

Method of forming a component overlying a semiconductor substrate

GONG ZHIWEI

Method of forming a packaged semiconductor device

Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits

VINCENT MICHAEL B

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

Microelectronic packages having trench vias and methods for the manufacture thereof

YAP WENG FOONG

Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof

Microelectronic packages and methods for the fabrication thereof

MAGNUS ALAN J

Semiconductor device package having backside contact and method for manufacturing

Microelectronic packages having layered interconnect structures and methods for the manufacture thereof

LIU LIANJUN

MEMS microphone with cavity and method therefor

RAMIAH CHANDRASEKARAM

Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods

MITCHELL DOUGLAS G

Chock block unit