Inventor

UCHIDA YASUFUMI

JP17 patents

⚠️ This page may combine multiple inventors who share the name “UCHIDA YASUFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UCHIDA YASUFUMI

OKI ELECTRIC IND CO LTD

Rearrangement sheet, semiconductor device and method of manufacturing thereof

Semiconductor device having multi-chip package

Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same

Semiconductor device having a die pad structure for preventing cracks in a molding resin

Method for selectively providing adhesive on a semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same

Semiconductor device having first and second chips

Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor

Multi-chip package semiconductor device having plural level interconnections

Method for fabricating multi-chip package semiconductor device

Rearrangement sheet, semiconductor device and method of manufacturing thereof

Semiconductor device with shock absorbing bond pad

Semiconductor device

Semiconductor device and manufacturing method thereof

OKI SEMICONDUCTOR CO LTD

Junction member comprising junction pads arranged in matrix and multichip package using same

NAKAJIMA TOYOAKI

Oxygen detection method, air leakage determination method, gas component detection device, and vacuum processing apparatus