Inventor · disambiguated record
Dale Curtis Mcherron
Also filed as: MCHERRON DALE · MCHERRON DALE C · MCHERRON DALE CURTIS
14 granted patents·2 pending applications·375 citations·filing 1995–2023
93Inventor score
Files withIBM16
Top patents by PatentIndex Score
16 records- 0190US6262390B1Repair process for aluminum nitride substratesIBM·Filed 1998·Granted Jul 17, 2001·66 cites·24 claims
- 0287US5977787ALarge area multiple-chip probe assembly and method of making the sameIBM·Filed 1997·Granted Nov 2, 1999·82 cites·31 claims
- 0387US5744752AHermetic thin film metallized sealband for SCM and MCM-D modulesIBM·Filed 1995·Granted Apr 28, 1998·82 cites·10 claims
- 0484US6892781B2Method and apparatus for application of pressure to a workpiece by thermal expansionIBM·Filed 2002·Granted May 17, 2005·38 cites·12 claims
- 0579US10991635B2Multiple chip bridge connectorIBM·Filed 2019·Granted Apr 27, 2021·2 cites·20 claims
- 0679US6174175B1High density Z-axis connectorIBM·Filed 1999·Granted Jan 16, 2001·38 cites·7 claims
- 0775US6518392B2Dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewithIBM·Filed 2001·Granted Feb 11, 2003·13 cites·24 claims
- 0869US6046074AHermetic thin film metallized sealband for SCM and MCM-D modulesIBM·Filed 1996·Granted Apr 4, 2000·33 cites·12 claims
- 0964US7475368B2Deflection analysis system and method for circuit designIBM·Filed 2006·Granted Jan 6, 2009·3 cites·9 claims
- 1062US12469787B2Resist patterned redistribution wiring on copper polyimide via layerIBM·Filed 2022·Granted Nov 11, 2025·0 cites·19 claims
- 1158US11355379B1Oxide-bonded wafer pair separation using laser debondingIBM·Filed 2020·Granted Jun 7, 2022·0 cites·18 claims
- 1257US6342455B2Process for forming an integrated circuitIBM·Filed 2001·Granted Jan 29, 2002·4 cites·15 claims
- 1356US2024332239A1Hybrid bond integration for multi-die assemblyIBM·Filed 2023·Application pending·0 cites
- 1454US11791270B2Direct bonded heterogeneous integration silicon bridgeIBM·Filed 2021·Granted Oct 17, 2023·0 cites·17 claims
- 1554US6265753B1Interconnect dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewithIBM·Filed 1999·Granted Jul 24, 2001·14 cites·6 claims
- 1638US2009026587A1Gradient deposition of low-k cvd materialsIBM·Filed 2004·Application pending·0 cites
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