Inventor

DADVAND NAZILA

US61 patents

⚠️ This page may combine multiple inventors who share the name “DADVAND NAZILA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DADVAND NAZILA

TEXAS INSTRUMENTS INC

Multi-super lattice for switchable arrays

Zinc-cobalt barrier for interface in solder bond applications

Multi-layered SP2-bonded carbon tubes

Lattice bump interconnect

Multi-pitch leads

Dissimilar material interface having lattices

Packaged multichip device with stacked die having a metal die attach

Multilayers of nickel alloys as diffusion barrier layers

Nickel lanthanide alloys for mems packaging applications

Multi-pitch leads

Electronic device with post mold plated nickel tungsten and tin bilayer for improved board level reliability

Neutral pH copper plating solution for undercut reduction

Contact with bronze material to mitigate undercut

Semiconductor package with nickel-silver pre-plated leadframe

Filler particles for polymers

Plating for thermal management

SP2-bonded carbon structures

Quad flat no-lead package with wettable flanges

Semiconductor device with metal die attach to substrate with multi-size cavity

Thermally conductive wafer layer

Semiconductor package with nickel-silver pre-plated leadframe

Nickel alloy for semiconductor packaging

Zinc-cobalt barrier for interface in solder bond applications

Hexagonal boron nitride structures

Nanoparticle matrix for backside heat spreading

Multi-super lattice for switchable arrays

Leadless packaged device with metal die attach

Filler particles for polymers

Nanostructure barrier for copper wire bonding

Metal-graphene structures forming a lattice of interconnected segments

Nickel alloy for semiconductor packaging

Zinc-cobalt barrier for interface in solder bond applications

Multi-chip package with high thermal conductivity die attach

Quad flat no-lead package with wettable flanges

Semiconductor device with metal die attach to substrate with multi-size cavity

Leadless packaged device with metal die attach

Die attach surface copper layer with protective layer for microelectronic devices

Method of forming brass-coated metals in flip-chip redistribution layers

Brass-coated metals in flip-chip redistribution layers

Die attach surface copper layer with protective layer for microelectronic devices

Zinc layer for a semiconductor die pillar

Nickel lanthanide alloys for MEMS packaging applications

Chemically anchored mold compounds in semiconductor packages

Semiconductor die with conversion coating

XTALIC CORP

Coated articles and methods

Electrodeposition baths, systems and methods

DADVAND NAZILA

Coated articles and methods

Coated articles and methods

LUND ALAN C

Electrodeposition baths, systems and methods

Electrodeposition baths, systems and methods