Inventor
SUTOU HOUKO
JP4 patents
Patents
4 patentsUS8518303B2Aug 27, 2013
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
KATOGI SHIGEKI2 citations59
US8138268B2Mar 20, 2012
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
KATOGI SHIGEKI2 citations58
US8696942B2Apr 15, 2014
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
KATOGI SHIGEKI0 citations49
US8309658B2Nov 13, 2012
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
KATOGI SHIGEKI0 citations48