Inventor
HORIKOSHI TAKAHIRO
JP19 patents
⚠️ This page may combine multiple inventors who share the name “HORIKOSHI TAKAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADEKA CORP
9 patentsUS11492461B2Nov 8, 2022
Resin additive composition, thermoplastic resin composition, and molded article thereof
ADEKA CORP3 citations71
US12122899B2Oct 22, 2024
Composition, thermoplastic resin composition using same, and molded article of same
ADEKA CORP0 citations62
US12024622B2Jul 2, 2024
Composition, thermoplastic resin composition using same, and molded article thereof
ADEKA CORP0 citations62
US11578188B2Feb 14, 2023
Composition, thermoplastic resin composition using same, and molded article of same
ADEKA CORP1 citations62
US8017678B2Sep 13, 2011
Polyester resin composition
ADEKA CORP5 citations62
US7662893B2Feb 16, 2010
Method for producing stabilized polymer
ADEKA CORP2 citations62
US12466938B2Nov 11, 2025
Resin additive composition, thermoplastic resin composition, and molded article thereof
ADEKA CORP0 citations61
US11999838B2Jun 4, 2024
Resin additive composition, thermoplastic resin composition, and molded article thereof
ADEKA CORP0 citations61
US11130851B2Sep 28, 2021
Particulate nucleating agent, resin composition, molded product, and production method thereof
ADEKA CORP1 citations61
NIKON CORP
4 patentsUS9299620B2Mar 29, 2016
Substrate bonding apparatus and substrate bonding method
NIKON CORP16 citations92
US6813004B1Nov 2, 2004
Exposure method, exposure apparatus and making method of the apparatus, and device and manufacturing method of the device
NIKON CORP37 citations90
US8856722B2Oct 7, 2014
System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
NIKON CORP2 citations62
US8370789B2Feb 5, 2013
System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
NIKON CORP0 citations52