Inventor
AZIMI HAMID
US12 patents
⚠️ This page may combine multiple inventors who share the name “AZIMI HAMID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS6430058B1Aug 6, 2002
Integrated circuit package
INTEL CORP23 citations91
US7042077B2May 9, 2006
Integrated circuit package with low modulus layer and capacitor/interposer
INTEL CORP35 citations90
US6413849B1Jul 2, 2002
Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor
INTEL CORP20 citations87
US10306760B2May 28, 2019
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
INTEL CORP6 citations83
US6858475B2Feb 22, 2005
Method of forming an integrated circuit substrate
INTEL CORP18 citations81
US6600233B2Jul 29, 2003
Integrated circuit package with surface mounted pins on an organic substrate
INTEL CORP11 citations68
US7985622B2Jul 26, 2011
Method of forming collapse chip connection bumps on a semiconductor substrate
INTEL CORP3 citations61
US7413936B2Aug 19, 2008
Method of forming copper layers
INTEL CORP3 citations59
US7005727B2Feb 28, 2006
Low cost programmable CPU package/substrate
INTEL CORP4 citations59
US12599010B2Apr 7, 2026
Microelectronic packages with embedded interposers
INTEL CORP0 citations51
LI YONGGANG
2 patentsUS8440916B2May 14, 2013
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
LI YONGGANG17 citations91
US9648733B2May 9, 2017
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
LI YONGGANG3 citations72