P

Inventor

WANG CHI-AN

TW10 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHI-AN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

POWERTECH TECHNOLOGY INC

6 patents
US11024603B2Jun 1, 2021

Manufacturing method and a related stackable chip package

POWERTECH TECHNOLOGY INC2 citations71
US10170458B2Jan 1, 2019

Manufacturing method of package-on-package structure

POWERTECH TECHNOLOGY INC1 citations61
US10354978B1Jul 16, 2019

Stacked package including exterior conductive element and a manufacturing method of the same

POWERTECH TECHNOLOGY INC1 citations60
US10424526B2Sep 24, 2019

Chip package structure and manufacturing method thereof

POWERTECH TECHNOLOGY INC0 citations51
US10276553B2Apr 30, 2019

Chip package structure and manufacturing method thereof

POWERTECH TECHNOLOGY INC0 citations50
US10177060B2Jan 8, 2019

Chip package structure and manufacturing method thereof

POWERTECH TECHNOLOGY INC0 citations50

WINBOND ELECTRONICS CORP

2 patents
US12089394B2Sep 10, 2024

Semiconductor structure

WINBOND ELECTRONICS CORP0 citations61
US11495605B2Nov 8, 2022

Semiconductor structure and manufacturing method thereof

WINBOND ELECTRONICS CORP0 citations61

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent
US12176390B2Dec 24, 2024

Semiconductor device structure and method for forming the semiconductor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

HUNG CHENG RIBBON ENTPR CO LTD

1 patent
US12467561B1Nov 11, 2025

Easy folding water pipe device

HUNG CHENG RIBBON ENTPR CO LTD0 citations32