P

Inventor

TSAI YUEH-YING

TW9 patents
⚠️ This page may combine multiple inventors who share the name “TSAI YUEH-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

7 patents
US6509636B1Jan 21, 2003

Semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD84 citations96
US6424024B1Jul 23, 2002

Leadframe of quad flat non-leaded package

SILICONWARE PRECISION INDUSTRIES CO LTD61 citations89
US11289409B2Mar 29, 2022

Method for fabricating carrier-free semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US9190296B2Nov 17, 2015

Fabrication method of semiconductor package without chip carrier

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations62
US10566271B2Feb 18, 2020

Carrier-free semiconductor package and fabrication method

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9029203B2May 12, 2015

Method of fabricating semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9257311B2Feb 9, 2016

Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47

TSAI YUEH-YING

1 patent
US8975734B2Mar 10, 2015

Semiconductor package without chip carrier and fabrication method thereof

TSAI YUEH-YING2 citations56

LIN PANG-CHUN

1 patent
US8525336B2Sep 3, 2013

Semiconductor package and method of fabricating the same

LIN PANG-CHUN1 citations48