Inventor
HWANG YISUNG
KR5 patents
⚠️ This page may combine multiple inventors who share the name “HWANG YISUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
4 patentsUS9698117B2Jul 4, 2017
Die bonding apparatus
SAMSUNG ELECTRONICS CO LTD8 citations78
US10083846B2Sep 25, 2018
Apparatuses for bonding semiconductor chips
SAMSUNG ELECTRONICS CO LTD2 citations70
US10629461B2Apr 21, 2020
Apparatuses for bonding semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations49
US9455165B2Sep 27, 2016
Die bonding device
SAMSUNG ELECTRONICS CO LTD1 citations45