Inventor
ZHAN KAI-JUN
TW19 patents
Patents
19 patentsUS12015002B2Jun 18, 2024
Chip structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11101233B1Aug 24, 2021
Semiconductor device and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10283471B1May 7, 2019
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12550769B2Feb 10, 2026
Method for forming a package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12463166B2Nov 4, 2025
Chip structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12444706B2Oct 14, 2025
Package bonding structures and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412858B2Sep 9, 2025
Semiconductor device structure with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12381171B2Aug 5, 2025
Semiconductor die including stress-resistant bonding structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990440B2May 21, 2024
Structure and formation method of semiconductor device with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11978720B2May 7, 2024
Semiconductor device package and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961817B2Apr 16, 2024
Apparatus and method for forming a package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942445B2Mar 26, 2024
Semiconductor device with conductive pad
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11887955B2Jan 30, 2024
Semiconductor die including stress-resistant bonding structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11742204B2Aug 29, 2023
Multi-layer structures and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11152319B2Oct 19, 2021
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004685B2May 11, 2021
Multi-layer structures and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12519080B2Jan 6, 2026
Systems for fluxless bonding using an atmospheric pressure plasma and methods for performing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10651142B2May 12, 2020
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12506109B2Dec 23, 2025
Die bonding tool with tiltable bond head for improved bonding and methods for performing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49