Inventor
VANG FOUA
US15 patents
⚠️ This page may combine multiple inventors who share the name “VANG FOUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
13 patentsUS9379058B2Jun 28, 2016
Grounding dummy gate in scaled layout design
QUALCOMM INC13 citations83
US9318476B2Apr 19, 2016
High performance standard cell with continuous oxide definition and characterized leakage current
QUALCOMM INC16 citations83
US8836040B2Sep 16, 2014
Shared-diffusion standard cell architecture
QUALCOMM INC17 citations83
US11710733B2Jul 25, 2023
Vertical power grid standard cell architecture
QUALCOMM INC4 citations73
US9887209B2Feb 6, 2018
Standard cell architecture with M1 layer unidirectional routing
QUALCOMM INC4 citations73
US11404374B2Aug 2, 2022
Circuits employing a back side-front side connection structure for coupling back side routing to front side routing, and related complementary metal oxide semiconductor (CMOS) circuits and methods
QUALCOMM INC3 citations72
US10175571B2Jan 8, 2019
Hybrid coloring methodology for multi-pattern technology
QUALCOMM INC3 citations71
US11237580B1Feb 1, 2022
Systems and methods providing leakage reduction for power gated domains
QUALCOMM INC0 citations62
US10593700B2Mar 17, 2020
Standard cell architecture with M1 layer unidirectional routing
QUALCOMM INC0 citations52
US11437379B2Sep 6, 2022
Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits
QUALCOMM INC0 citations51
US11290109B1Mar 29, 2022
Multibit multi-height cell to improve pin accessibility
QUALCOMM INC0 citations48
US9053960B2Jun 9, 2015
Decoupling capacitor for integrated circuit
QUALCOMM INC0 citations41
US10692808B2Jun 23, 2020
High performance cell design in a technology with high density metal routing
QUALCOMM INC0 citations37