Inventor
AN YONGHAO
US4 patents
⚠️ This page may combine multiple inventors who share the name “AN YONGHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
3 patentsUS11804428B2Oct 31, 2023
Mixed pad size and pad design
QUALCOMM INC0 citations58
US11189575B1Nov 30, 2021
Specialized surface mount device for symmetric heat distribution in package
QUALCOMM INC0 citations56
US11545411B2Jan 3, 2023
Package comprising wire bonds configured as a heat spreader
QUALCOMM INC0 citations47