Inventor
BAE MINJUN
KR9 patents
⚠️ This page may combine multiple inventors who share the name “BAE MINJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS10950539B2Mar 16, 2021
Redistribution substrate, method of fabricating the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD5 citations83
US11264354B2Mar 1, 2022
Wafer level package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11894338B2Feb 6, 2024
Wafer level package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11973028B2Apr 30, 2024
Redistribution substrate, method of fabricating the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11600564B2Mar 7, 2023
Redistribution substrate, method of fabricating the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12230556B2Feb 18, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11948872B2Apr 2, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US12014975B2Jun 18, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50