Inventor
JEON GWANGJAE
KR14 patents
Patents
14 patentsUS11348864B2May 31, 2022
Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US11929316B2Mar 12, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11646260B2May 9, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US12394700B2Aug 19, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11804427B2Oct 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11056461B2Jul 6, 2021
Method of manufacturing fan-out wafer level package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11705341B2Jul 18, 2023
Method of fabricating a semiconductor package having redistribution patterns including seed patterns and seed layers
SAMSUNG ELECTRONICS CO LTD1 citations61
US11508649B2Nov 22, 2022
Semiconductor package including substrate with outer insulating layer
SAMSUNG ELECTRONICS CO LTD0 citations61
US12230556B2Feb 18, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11948872B2Apr 2, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US12451449B2Oct 21, 2025
Semiconductor package, and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11837551B2Dec 5, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11791295B2Oct 17, 2023
Semiconductor package with thick under-bump terminal
SAMSUNG ELECTRONICS CO LTD0 citations51
US12300589B2May 13, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations46