Inventor

NAPETSCHNIG EVELYN

AT24 patents

⚠️ This page may combine multiple inventors who share the name “NAPETSCHNIG EVELYN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAPETSCHNIG EVELYN

INFINEON TECHNOLOGIES AG

Solder metallization stack and methods of formation thereof

Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device

Semiconductor devices and methods of forming thereof

Semiconductor devices and methods of forming thereof

Component and method of manufacturing a component using an ultrathin carrier

Chip package and method of forming a chip package

Semiconductor device including a solder compound containing a compound Sn/Sb

Chip package and method of forming a chip package

Electronic device, electronic module and methods for fabricating the same

Semiconductor device including a solder compound containing a compound Sn/Sb

Chip arrangements

Electronic device, electronic module and methods for fabricating the same

Semiconductor device including bonding pad metal layer structure

Semiconductor device including bonding pad metal layer structure

Semiconductor substrate having a bond pad material based on aluminum

Backside processing of semiconductor devices

Solder metallization stack and methods of formation thereof

Method for processing a semiconductor region and an electronic device

Porous Cu on Cu surface for semiconductor packages

Method for processing a semiconductor workpiece and semiconductor workpiece

HARRISON MARK

Backside processing of semiconductor devices

INFINEON TECHNOLOGIES AUSTRIA AG

Semiconductor device and method of producing a semiconductor device

MAYER KARL

Component and method of manufacturing a component using an ultrathin carrier

MENGEL MANFRED

Solder alloys and arrangements