Inventor · disambiguated record
Julia Zischang
Also filed as: ZISCHANG JULIA
2 granted patents·1 pending application·0 citations·filing 2021–2023
28Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0172US12183696B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 31, 2024·0 cites·25 claims
- 0263US11764176B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 0348US2024113053A1Semiconductor device and method of producing thereofINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →