Inventor
MELTON CYNTHIA M
US19 patents
⚠️ This page may combine multiple inventors who share the name “MELTON CYNTHIA M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
18 patentsUS6194250B1Feb 27, 2001
Low-profile microelectronic package
MOTOROLA INC385 citations97
US5269453ADec 14, 1993
Low temperature method for forming solder bump interconnections to a plated circuit trace
MOTOROLA INC180 citations97
US6093972AJul 25, 2000
Microelectronic package including a polymer encapsulated die
MOTOROLA INC125 citations96
US5895229AApr 20, 1999
Microelectronic package including a polymer encapsulated die, and method for forming same
MOTOROLA INC128 citations96
US5282565AFeb 1, 1994
Solder bump interconnection formed using spaced solder deposit and consumable path
MOTOROLA INC62 citations96
US5229070AJul 20, 1993
Low temperature-wetting tin-base solder paste
MOTOROLA INC79 citations95
US5221038AJun 22, 1993
Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
MOTOROLA INC63 citations95
US5154341AOct 13, 1992
Noncollapsing multisolder interconnection
MOTOROLA INC107 citations94
US5452842ASep 26, 1995
Tin-zinc solder connection to a printed circuit board or the like
MOTOROLA INC47 citations93
US5814401ASep 29, 1998
Selectively filled adhesive film containing a fluxing agent
MOTOROLA INC50 citations92
US5597110AJan 28, 1997
Method for forming a solder bump by solder-jetting or the like
MOTOROLA INC58 citations91
US5429292AJul 4, 1995
Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
MOTOROLA INC27 citations91
US5233504AAug 3, 1993
Noncollapsing multisolder interconnection
MOTOROLA INC43 citations91
US5086966AFeb 11, 1992
Palladium-coated solder ball
MOTOROLA INC41 citations90
US5435838AJul 25, 1995
Immersion plating of tin-bismuth solder
MOTOROLA INC22 citations89
US5390080AFeb 14, 1995
Tin-zinc solder connection to a printed circuit board of the like
MOTOROLA INC40 citations89
US5389160AFeb 14, 1995
Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
MOTOROLA INC14 citations72
US5391402AFeb 21, 1995
Immersion plating of tin-bismuth solder
MOTOROLA INC1 citations48