Inventor
HONG SAM-HYO
SE7 patents
⚠️ This page may combine multiple inventors who share the name “HONG SAM-HYO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ERICSSON TELEFON AB L M
5 patentsUS5821620AOct 13, 1998
Electromigration resistant metallization structures for microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold
ERICSSON TELEFON AB L M39 citations94
US6211568B1Apr 3, 2001
Electromigration resistant metallization structures and process for microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold
ERICSSON TELEFON AB L M12 citations71
US5920794AJul 6, 1999
Electromigration resistant metallization process microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold
ERICSSON TELEFON AB L M11 citations71
US6406972B2Jun 18, 2002
Integrated circuit, components thereof and manufacturing method
ERICSSON TELEFON AB L M12 citations70
US6251739B1Jun 26, 2001
Integrated circuit, components thereof and manufacturing method
ERICSSON TELEFON AB L M11 citations70