P

Inventor

NG HOU TEE

SG10 patents
⚠️ This page may combine multiple inventors who share the name “NG HOU TEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHARTERED SEMICONDUCTOR MFG

5 patents
US6136693AOct 24, 2000

Method for planarized interconnect vias using electroless plating and CMP

CHARTERED SEMICONDUCTOR MFG289 citations98
US6214728B1Apr 10, 2001

Method to encapsulate copper plug for interconnect metallization

CHARTERED SEMICONDUCTOR MFG52 citations95
US6696761B2Feb 24, 2004

Method to encapsulate copper plug for interconnect metallization

CHARTERED SEMICONDUCTOR MFG17 citations92
US6495200B1Dec 17, 2002

Method to deposit a seeding layer for electroless copper plating

CHARTERED SEMICONDUCTOR MFG77 citations92
US6281117B1Aug 28, 2001

Method to form uniform silicide features

CHARTERED SEMICONDUCTOR MFG6 citations58

HEWLETT PACKARD DEVELOPMENT CO

2 patents
US8029852B2Oct 4, 2011

Contact printing oxide-based electrically active micro-features

HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7718545B1May 18, 2010

Fabrication process

HEWLETT PACKARD DEVELOPMENT CO2 citations62

NASA

1 patent
US7217650B1May 15, 2007

Metallic nanowire interconnections for integrated circuit fabrication

NASA33 citations92

INST MATERIALS RESEARCH & ENG

1 patent
US6181097B1Jan 30, 2001

High precision three-dimensional alignment system for lithography, fabrication and inspection

INST MATERIALS RESEARCH & ENG41 citations91

UNIV SINGAPORE

1 patent
US6660636B1Dec 9, 2003

Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating

UNIV SINGAPORE4 citations61