Inventor
LI CHAOYONG
SG3 patents
Patents
3 patentsUS7244674B2Jul 17, 2007
Process of forming a composite diffusion barrier in copper/organic low-k damascene technology
AGENCY SCIENCE TECH & RES10 citations79
US7335990B2Feb 26, 2008
Process of forming a composite diffusion barrier in copper/organic low-k damascene technology
AGENCY SCIENCE TECH & RES3 citations57
US6872657B2Mar 29, 2005
Method to form copper seed layer for copper interconnect
AGENCY SCIENCE TECH & RES5 citations51