Inventor
SON SEONG-MIN
KR18 patents
⚠️ This page may combine multiple inventors who share the name “SON SEONG-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYUNDAI MOTOR CO LTD
8 patentsUS11754172B2Sep 12, 2023
Powertrain-cooling system of hybrid vehicle
HYUNDAI MOTOR CO LTD6 citations73
US11168785B1Nov 9, 2021
Hydraulic pressure control method for transmission
HYUNDAI MOTOR CO LTD2 citations69
US12007018B2Jun 11, 2024
Hydraulic pressure control method for a vehicle transmission
HYUNDAI MOTOR CO LTD0 citations62
US11946541B2Apr 2, 2024
Method of controlling EOP of powertrain of vehicle
HYUNDAI MOTOR CO LTD0 citations61
US11614162B2Mar 28, 2023
Method of controlling an electric oil pump of a vehicle
HYUNDAI MOTOR CO LTD0 citations61
US11578796B2Feb 14, 2023
Method for controlling EOP of hybrid vehicle
HYUNDAI MOTOR CO LTD0 citations61
US11643952B2May 9, 2023
Method of controlling electric oil pump for vehicle
HYUNDAI MOTOR CO LTD0 citations51
US11603919B2Mar 14, 2023
Method of controlling EOP of hybrid vehicle
HYUNDAI MOTOR CO LTD0 citations50
SAMSUNG ELECTRONICS CO LTD
8 patentsUS10833032B2Nov 10, 2020
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US10580726B2Mar 3, 2020
Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations72
US10483224B2Nov 19, 2019
Semiconductor chip
SAMSUNG ELECTRONICS CO LTD1 citations72
US9496218B2Nov 15, 2016
Integrated circuit device having through-silicon-via structure
SAMSUNG ELECTRONICS CO LTD4 citations72
US11798906B2Oct 24, 2023
Semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations62
US11469202B2Oct 11, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations62
US11251144B2Feb 15, 2022
Semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations62
US9006902B2Apr 14, 2015
Semiconductor devices having through silicon vias and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations62
JUNG DEOK-YOUNG
2 patentsUS8963336B2Feb 24, 2015
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
JUNG DEOK-YOUNG12 citations82
US9064941B2Jun 23, 2015
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
JUNG DEOK-YOUNG5 citations71