Inventor
JUNG WOON SUK
KR5 patents
Patents
5 patentsUS11879181B2Jan 23, 2024
Electroplating solution of tin or tin alloy with improved thickness variation of wafer bumps
HOJIN PLATECH CO LTD0 citations58
US12071703B2Aug 27, 2024
Electroplating solution for indium-bismuth alloy for low-temperature solder with improved bismuth substitution prevention performance
HOJIN PLATECH CO LTD0 citations57
US9150977B2Oct 6, 2015
Copper plating solution
HOJIN PLATECH CO LTD2 citations55
US9525096B2Dec 20, 2016
Plating equipment for solar cell wafer using electroplating and light-induced plating jointly and method of the same
HOJIN PLATECH CO LTD0 citations34
US9194053B2Nov 24, 2015
Substrate carrier device for double-sided electroplating of solar cell
HOJIN PLATECH CO LTD0 citations34