Inventor
AOYAMA MASAMI
JP10 patents
Patents
10 patentsUS10563096B2Feb 18, 2020
Conductive adhesive composition
FURUKAWA ELECTRIC CO LTD1 citations59
US10196547B2Feb 5, 2019
Resin composition for sealing electronic device, and electronic device
FURUKAWA ELECTRIC CO LTD1 citations59
US10115707B2Oct 30, 2018
Adhesive film and semiconductor package using adhesive film
FURUKAWA ELECTRIC CO LTD0 citations49
US9758690B2Sep 12, 2017
Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image
FURUKAWA ELECTRIC CO LTD1 citations49
US10699933B2Jun 30, 2020
Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip
FURUKAWA ELECTRIC CO LTD0 citations48
US9631123B2Apr 25, 2017
Adhesive sheet
FURUKAWA ELECTRIC CO LTD1 citations48
US9523023B2Dec 20, 2016
Adhesive sheet
FURUKAWA ELECTRIC CO LTD1 citations48
US10043996B2Aug 7, 2018
Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device
FURUKAWA ELECTRIC CO LTD0 citations39
US10418267B2Sep 17, 2019
Method of processing a semiconductor wafer, semiconductor chip, and surface protective tape
FURUKAWA ELECTRIC CO LTD0 citations38
US10196534B2Feb 5, 2019
Resin composition for sealing electronic device, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations38