Inventor
LI LIWEN
CN19 patents
⚠️ This page may combine multiple inventors who share the name “LI LIWEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ZEPHYROS INC
7 patentsUS10183699B2Jan 22, 2019
Multiple stage deformation reinforcement structure for impact absorption
ZEPHYROS INC5 citations83
US10173727B2Jan 8, 2019
Multiple stage deformation reinforcement structure for impact absorption
ZEPHYROS INC9 citations83
US11565755B2Jan 31, 2023
Multiple stage deformation reinforcement structure for impact absorption
ZEPHYROS INC1 citations72
US12286158B2Apr 29, 2025
Multiple stage deformation reinforcement structure for impact absorption
ZEPHYROS INC0 citations62
US11465686B2Oct 11, 2022
Multiple stage deformation reinforcement structure for impact absorption
ZEPHYROS INC0 citations62
US10875579B2Dec 29, 2020
Multiple stage deformation reinforcement structure for impact absorption
ZEPHYROS INC0 citations51
US12145330B2Nov 19, 2024
Pultruded articles and methods for making same
ZEPHYROS INC0 citations48
GUANGZHOU LVQI OUTDOOR PRODUCTS CO LTD
4 patentsUSD1016900SMar 5, 2024
Goggles
GUANGZHOU LVQI OUTDOOR PRODUCTS CO LTD6 citations83
USD1058656SJan 21, 2025
Goggles
GUANGZHOU LVQI OUTDOOR PRODUCTS CO LTD3 citations72
USD1040217SAug 27, 2024
Goggles
GUANGZHOU LVQI OUTDOOR PRODUCTS CO LTD3 citations72
USD1013024SJan 30, 2024
Goggles
GUANGZHOU LVQI OUTDOOR PRODUCTS CO LTD2 citations71
LI LIWEN
4 patentsQIU NING
2 patentsHANGZHOU SILAN INTEGRATED CIRCUIT CO LTD
2 patentsUS10513431B2Dec 24, 2019
Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof
HANGZHOU SILAN INTEGRATED CIRCUIT CO LTD0 citations49
US10081541B2Sep 25, 2018
Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof
HANGZHOU SILAN INTEGRATED CIRCUIT CO LTD0 citations49