Inventor

REINGRUBER KLAUS

DE31 patents

⚠️ This page may combine multiple inventors who share the name “REINGRUBER KLAUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

REINGRUBER KLAUS

INTEL IP CORP

System-in-package devices and methods for forming system-in-package devices

Integrated circuit package assemblies including a chip recess

Electronic components having three-dimensional capacitors in a metallization stack

Integrated circuit package assemblies including a chip recess

Electrical device and a method for forming an electrical device

Integrated circuit packages including an optical redistribution layer

Redistribution layer lines

Wafer level package structure with internal conductive layer

Interposer with conductive routing exposed on sidewalls

Vertical wire connections for integrated circuit package

Interconnect structure for a microelectronic device

Semiconductor die package with more than one hanging die

Integrated circuit packages including an optical redistribution layer

Advanced node cost reduction by ESD interposer

Electronic package with coil formed on core

Cooler for semiconductor devices

Microelectronic package with illuminated backside exterior

Flexible band wearable electronic device

INTEL CORP

Three dimensional structures within mold compound

Package stacking using chip to wafer bonding

Package stacking using chip to wafer bonding

Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics

Wafer level package structure with internal conductive layer

Wearable computing device

OSRAM OLED GMBH

Optoelectronic component and method for producing an optoelectronic component

Method of producing a lighting device

Method for producing optoelectronic semiconductor components, and optoelectronic semiconductor component

INTEL MOBILE COMM GMBH

Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip

GANESAN SANKA

Package on package architecture and method for making

MEYER THORSTEN

Chip with encapsulated sides and exposed surface

OSRAM OPTO SEMICONDUCTORS GMBH

Optoelectronic component and method of producing an optoelectronic component