Inventor
LEE CHANG BAE
KR34 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHANG BAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
12 patentsUS10312195B2Jun 4, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH3 citations73
US9472340B2Oct 18, 2016
Coil type unit for wireless power transmission, wireless power transmission device, electronic device and manufacturing method of coil type unit for wireless power transmission
SAMSUNG ELECTRO MECH2 citations62
US9035196B2May 19, 2015
Circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US10186875B2Jan 22, 2019
Coil type unit for wireless power transmission, wireless power transmission device, electronic device and manufacturing method of coil type unit for wireless power transmission
SAMSUNG ELECTRO MECH0 citations51
US9502173B2Nov 22, 2016
Shield part, method of fabricating the same, and contactless power transmission device having the shield part
SAMSUNG ELECTRO MECH0 citations51
US9320142B2Apr 19, 2016
Electrode structure
SAMSUNG ELECTRO MECH0 citations51
US9253873B2Feb 2, 2016
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US9235008B2Jan 12, 2016
Optical connector and optical module having the same
SAMSUNG ELECTRO MECH0 citations51
US9236177B2Jan 12, 2016
Common mode filter
SAMSUNG ELECTRO MECH0 citations51
US9095068B2Jul 28, 2015
Circuit board
SAMSUNG ELECTRO MECH0 citations51
US10229865B2Mar 12, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH0 citations40
US9236339B2Jan 12, 2016
Plug via stacked structure, stacked substrate having via stacked structure and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations40
SAMSUNG ELECTRONICS CO LTD
6 patentsUS10727212B2Jul 28, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD36 citations94
US7988372B2Aug 2, 2011
Camera having detachable lens module
SAMSUNG ELECTRONICS CO LTD48 citations93
US11676907B2Jun 13, 2023
Semiconductor package and antenna module comprising the same
SAMSUNG ELECTRONICS CO LTD4 citations74
US11062999B2Jul 13, 2021
Semiconductor package and antenna module comprising the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US12148708B2Nov 19, 2024
Semiconductor package and antenna module comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US8366329B2Feb 5, 2013
Lens barrel assembly and camera including the same
SAMSUNG ELECTRONICS CO LTD1 citations51
LEE CHANG-BAE
4 patentsUS8057111B2Nov 15, 2011
Lens barrel assembly and camera including the same
LEE CHANG-BAE2 citations61
US8162549B2Apr 24, 2012
Optical assembly and photographing apparatus including the same
LEE CHANG-BAE1 citations50
US8511054B2Aug 20, 2013
Method of assembling filaments and bundle of filaments obtained by the method
LEE CHANG-BAE0 citations45
US8302373B2Nov 6, 2012
Method of assembling filaments and bundle of filaments obtained by the method
LEE CHANG-BAE1 citations45