Inventor
HAEHN NICHOLAS
US7 patents
Patents
7 patentsUS11640929B2May 2, 2023
Thermal management solutions for cored substrates
INTEL CORP2 citations68
US11528811B2Dec 13, 2022
Method, device and system for providing etched metallization structures
INTEL CORP0 citations60
US11116084B2Sep 7, 2021
Method, device and system for providing etched metallization structures
INTEL CORP0 citations60
US12068222B2Aug 20, 2024
Dummy die structures of a packaged integrated circuit device
INTEL CORP1 citations59
US11594463B2Feb 28, 2023
Substrate thermal layer for heat spreader connection
INTEL CORP0 citations59
US12400363B2Aug 26, 2025
Device and method for improved fiducial marker detection
INTEL CORP0 citations57
US11652036B2May 16, 2023
Via-trace structures
INTEL CORP0 citations50