Inventor
OJEDA OSCAR
US11 patents
Patents
11 patentsUS11948848B2Apr 2, 2024
Subtractive etch resolution implementing a functional thin metal resist
INTEL CORP0 citations62
US11817349B2Nov 14, 2023
Conductive route patterning for electronic substrates
INTEL CORP0 citations61
US11528811B2Dec 13, 2022
Method, device and system for providing etched metallization structures
INTEL CORP0 citations60
US11116084B2Sep 7, 2021
Method, device and system for providing etched metallization structures
INTEL CORP0 citations60
US12543578B2Feb 3, 2026
Electronic packaging architecture with customized variable metal thickness on same buildup layer
INTEL CORP0 citations59
US11721631B2Aug 8, 2023
Via structures having tapered profiles for embedded interconnect bridge substrates
INTEL CORP0 citations59
US11373951B2Jun 28, 2022
Via structures having tapered profiles for embedded interconnect bridge substrates
INTEL CORP0 citations59
US10798817B2Oct 6, 2020
Method for making a flexible wearable circuit
INTEL CORP1 citations59
US11652036B2May 16, 2023
Via-trace structures
INTEL CORP0 citations50
US10515824B2Dec 24, 2019
Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field
INTEL CORP0 citations50
US12191161B2Jan 7, 2025
Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors
INTEL CORP0 citations44