Inventor
WANG HSIN-WEI
US11 patents
⚠️ This page may combine multiple inventors who share the name “WANG HSIN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS11817349B2Nov 14, 2023
Conductive route patterning for electronic substrates
INTEL CORP0 citations61
US11528811B2Dec 13, 2022
Method, device and system for providing etched metallization structures
INTEL CORP0 citations60
US11116084B2Sep 7, 2021
Method, device and system for providing etched metallization structures
INTEL CORP0 citations60
US10515824B2Dec 24, 2019
Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field
INTEL CORP0 citations50
US12002727B2Jun 4, 2024
Barrier structures for underfill containment
INTEL CORP0 citations44
CHIUN MAI COMMUNICATION SYSTEMS INC
4 patentsUS10437299B2Oct 8, 2019
Heat-dissipating structure of electronic device
CHIUN MAI COMMUNICATION SYSTEMS INC3 citations71
US9433265B2Sep 6, 2016
Bracelet and detecting device using the same
CHIUN MAI COMMUNICATION SYSTEMS INC1 citations49
US9449163B2Sep 20, 2016
Electronic device and method for logging in application program of the electronic device
CHIUN MAI COMMUNICATION SYSTEMS INC0 citations38
US9418277B2Aug 16, 2016
Electronic device and method for unlocking the electronic device
CHIUN MAI COMMUNICATION SYSTEMS INC0 citations38