P

Inventor

KIM HONG-GUN

KR26 patents
⚠️ This page may combine multiple inventors who share the name “KIM HONG-GUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

23 patents
US6566229B2May 20, 2003

Method of forming an insulating layer in a trench isolation type semiconductor device

SAMSUNG ELECTRONICS CO LTD102 citations97
US7674685B2Mar 9, 2010

Semiconductor device isolation structures and methods of fabricating such structures

SAMSUNG ELECTRONICS CO LTD21 citations92
US7192891B2Mar 20, 2007

Method for forming a silicon oxide layer using spin-on glass

SAMSUNG ELECTRONICS CO LTD21 citations92
US6635586B2Oct 21, 2003

Method of forming a spin-on-glass insulation layer

SAMSUNG ELECTRONICS CO LTD27 citations92
US6489252B2Dec 3, 2002

Method of forming a spin-on-glass insulation layer

SAMSUNG ELECTRONICS CO LTD28 citations92
US7015144B2Mar 21, 2006

Compositions including perhydro-polysilazane used in a semiconductor manufacturing process and methods of manufacturing semiconductor devices using the same

SAMSUNG ELECTRONICS CO LTD15 citations90
US9627469B2Apr 18, 2017

Oxide film, integrated circuit device, and methods of forming the same

SAMSUNG ELECTRONICS CO LTD7 citations83
US7601588B2Oct 13, 2009

Method of forming a trench isolation layer and method of manufacturing a non-volatile memory device using the same

SAMSUNG ELECTRONICS CO LTD12 citations83
US10490623B2Nov 26, 2019

Semiconductor device including a plurality of electrodes and supporters

SAMSUNG ELECTRONICS CO LTD6 citations82
US7585786B2Sep 8, 2009

Methods of forming spin-on-glass insulating layers in semiconductor devices and associated semiconductor device

SAMSUNG ELECTRONICS CO LTD11 citations82
US9263536B2Feb 16, 2016

Methods of fabricating semiconductor devices with electrode support patterns

SAMSUNG ELECTRONICS CO LTD18 citations81
US7517817B2Apr 14, 2009

Method for forming a silicon oxide layer using spin-on glass

SAMSUNG ELECTRONICS CO LTD7 citations73
US6645879B2Nov 11, 2003

Method of forming a silicon oxide layer of a semiconductor device and method of forming a wiring having the same

SAMSUNG ELECTRONICS CO LTD7 citations73
US7842569B2Nov 30, 2010

Flash memory device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD7 citations72
US6774048B2Aug 10, 2004

Method of manufacturing a semiconductor device

SAMSUNG ELECTRONICS CO LTD9 citations72
US10879345B2Dec 29, 2020

Semiconductor device including a plurality of electrodes and supporters

SAMSUNG ELECTRONICS CO LTD3 citations71
US10170541B2Jan 1, 2019

Semiconductor device including a plurality of electrodes and supporters

SAMSUNG ELECTRONICS CO LTD3 citations71
US7358190B2Apr 15, 2008

Methods of filling gaps by deposition on materials having different deposition rates

SAMSUNG ELECTRONICS CO LTD6 citations62
US11626476B2Apr 11, 2023

Semiconductor device including a plurality of electrodes and supporters

SAMSUNG ELECTRONICS CO LTD0 citations61
US7429637B2Sep 30, 2008

Compositions including perhydro-polysilazane used in a semiconductor manufacturing process and methods of manufacturing semiconductor devices using the same

SAMSUNG ELECTRONICS CO LTD3 citations60
US9142610B2Sep 22, 2015

Semiconductor device including supporters on a lower electrode thereof and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations59
US7534698B2May 19, 2009

Methods of forming semiconductor devices having multilayer isolation structures

SAMSUNG ELECTRONICS CO LTD0 citations51
US7867924B2Jan 11, 2011

Methods of reducing impurity concentration in isolating films in semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations49

UNIV JEONJU IND UNIV COOP

2 patents

CHOI YONG-SOON

1 patent