Inventor
KIM HONG-GUN
KR26 patents
⚠️ This page may combine multiple inventors who share the name “KIM HONG-GUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
23 patentsUS6566229B2May 20, 2003
Method of forming an insulating layer in a trench isolation type semiconductor device
SAMSUNG ELECTRONICS CO LTD102 citations97
US7674685B2Mar 9, 2010
Semiconductor device isolation structures and methods of fabricating such structures
SAMSUNG ELECTRONICS CO LTD21 citations92
US7192891B2Mar 20, 2007
Method for forming a silicon oxide layer using spin-on glass
SAMSUNG ELECTRONICS CO LTD21 citations92
US6635586B2Oct 21, 2003
Method of forming a spin-on-glass insulation layer
SAMSUNG ELECTRONICS CO LTD27 citations92
US6489252B2Dec 3, 2002
Method of forming a spin-on-glass insulation layer
SAMSUNG ELECTRONICS CO LTD28 citations92
US7015144B2Mar 21, 2006
Compositions including perhydro-polysilazane used in a semiconductor manufacturing process and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD15 citations90
US9627469B2Apr 18, 2017
Oxide film, integrated circuit device, and methods of forming the same
SAMSUNG ELECTRONICS CO LTD7 citations83
US7601588B2Oct 13, 2009
Method of forming a trench isolation layer and method of manufacturing a non-volatile memory device using the same
SAMSUNG ELECTRONICS CO LTD12 citations83
US10490623B2Nov 26, 2019
Semiconductor device including a plurality of electrodes and supporters
SAMSUNG ELECTRONICS CO LTD6 citations82
US7585786B2Sep 8, 2009
Methods of forming spin-on-glass insulating layers in semiconductor devices and associated semiconductor device
SAMSUNG ELECTRONICS CO LTD11 citations82
US9263536B2Feb 16, 2016
Methods of fabricating semiconductor devices with electrode support patterns
SAMSUNG ELECTRONICS CO LTD18 citations81
US7517817B2Apr 14, 2009
Method for forming a silicon oxide layer using spin-on glass
SAMSUNG ELECTRONICS CO LTD7 citations73
US6645879B2Nov 11, 2003
Method of forming a silicon oxide layer of a semiconductor device and method of forming a wiring having the same
SAMSUNG ELECTRONICS CO LTD7 citations73
US7842569B2Nov 30, 2010
Flash memory device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD7 citations72
US6774048B2Aug 10, 2004
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD9 citations72
US10879345B2Dec 29, 2020
Semiconductor device including a plurality of electrodes and supporters
SAMSUNG ELECTRONICS CO LTD3 citations71
US10170541B2Jan 1, 2019
Semiconductor device including a plurality of electrodes and supporters
SAMSUNG ELECTRONICS CO LTD3 citations71
US7358190B2Apr 15, 2008
Methods of filling gaps by deposition on materials having different deposition rates
SAMSUNG ELECTRONICS CO LTD6 citations62
US11626476B2Apr 11, 2023
Semiconductor device including a plurality of electrodes and supporters
SAMSUNG ELECTRONICS CO LTD0 citations61
US7429637B2Sep 30, 2008
Compositions including perhydro-polysilazane used in a semiconductor manufacturing process and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD3 citations60
US9142610B2Sep 22, 2015
Semiconductor device including supporters on a lower electrode thereof and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations59
US7534698B2May 19, 2009
Methods of forming semiconductor devices having multilayer isolation structures
SAMSUNG ELECTRONICS CO LTD0 citations51
US7867924B2Jan 11, 2011
Methods of reducing impurity concentration in isolating films in semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations49
UNIV JEONJU IND UNIV COOP
2 patentsUS12049714B2Jul 30, 2024
Metal nanoparticles impregnated activated carbon fiber for removing harmful substances, and method of manufacturing same
UNIV JEONJU IND UNIV COOP0 citations49
US11753722B2Sep 12, 2023
Method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefrom
UNIV JEONJU IND UNIV COOP0 citations35