Inventor

POHL JENS

DE120 patents

⚠️ This page may combine multiple inventors who share the name “POHL JENS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

POHL JENS

INFINEON TECHNOLOGIES AG

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor module with a semiconductor stack, and methods for its production

Semiconductor package and method for fabricating the same

Through substrate via semiconductor components

Reconfigured wafer alignment

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Smart card, smart card module, and a method for production of a smart card module

Electronic component with flexible contacting pads and method for producing the electronic component

Device for packaging electronic components

Integrated circuit with re-route layer and stacked die assembly

Memory system

Electronic circuit having a flexible intermediate layer between electronic components and a heat sink

On-chip RF shields with backside redistribution lines

Package for an electronic component and method for its production

Connection of integrated circuits

Device for fixing a heat distribution covering on a printed circuit board with heat distribution covering

Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method

Semiconductor device having a chip stack on a rewiring plate

Encasing arrangement for a semiconductor component

Electronic structure with components connected by way of solderable connecting elements and method

Method for connecting circuit devices

Chip card module arrangement, chip card arrangement and method for producing a chip card arrangement

Method for singling semiconductor components and semiconductor component singling device

BIOPH BIOTECH ENTW PHARM GMBH

Growth/differentiation factors of the TGF-β family

Osteoinductive materials

DNA sequences encoding growth/differentiation

Compounds with improved cartilage-inducing and/or bone-inducing activity

Method of treatment with growth/differentiation factors of the TGF-β family

Use of MP52 or MP121 for treating and preventing diseases of the nervous system

MP121, a growth/differentiation factor of the TGF-β family

DNA encoding growth/differentiation factor

BRUNNBAUER MARKUS

Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Structure for electrostatic discharge in embedded wafer level packages

BARTH HANS-JOACHIM

On-chip RF shields with through substrate conductors

Semiconductor structure and method for making same

On-chip RF shields with backside redistribution lines

MEYER THORSTEN

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Semiconductor device including adhesive covered element

INTEL MOBILE COMM GMBH

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

QIMONDA AG

Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel

Integrated circuit with re-route layer and stacked die assembly

SIEMENS AG

Integrated semiconductor circuit housing

Semiconductor component assembly

POHL JENS

Stackable semiconductor package with encapsulant and electrically conductive feed-through

HYGENE AG

Monomeric protein of the TGF-β family

INFINEON TECHNOLOGIES AUSTRIA AG

Chip card module and method for producing a chip card module