Inventor
NAM KI MYUNG
KR19 patents
⚠️ This page may combine multiple inventors who share the name “NAM KI MYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POINT ENGINEERING CO LTD
17 patentsUS9559268B2Jan 31, 2017
Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method
POINT ENGINEERING CO LTD3 citations73
US9281452B2Mar 8, 2016
Method for manufacturing a can package-type optical device, and optical device manufactured thereby
POINT ENGINEERING CO LTD2 citations62
US9018651B2Apr 28, 2015
Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereof
POINT ENGINEERING CO LTD2 citations62
US10008638B2Jun 26, 2018
Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method
POINT ENGINEERING CO LTD0 citations52
US9666558B2May 30, 2017
Substrate for mounting a chip and chip package using the substrate
POINT ENGINEERING CO LTD0 citations52
US9378986B2Jun 28, 2016
Method for mounting a chip and chip package
POINT ENGINEERING CO LTD1 citations52
US10062812B2Aug 28, 2018
Substrate for can package-type optical device and optical device using same
POINT ENGINEERING CO LTD0 citations51
US9374890B2Jun 21, 2016
Chip substrate having a lens insert
POINT ENGINEERING CO LTD1 citations51
US9666565B2May 30, 2017
Optical device and method for manufacturing same
POINT ENGINEERING CO LTD0 citations50
US9537074B2Jan 3, 2017
High heat-radiant optical device substrate
POINT ENGINEERING CO LTD0 citations50
US9316768B2Apr 19, 2016
Substrate for preventing burr generation
POINT ENGINEERING CO LTD0 citations50
US9287243B2Mar 15, 2016
Optical device and method for manufacturing same
POINT ENGINEERING CO LTD0 citations50
US9214453B2Dec 15, 2015
Optical device and method for manufacturing same
POINT ENGINEERING CO LTD0 citations50
US9818913B2Nov 14, 2017
Chip substrate
POINT ENGINEERING CO LTD0 citations42
US9595642B2Mar 14, 2017
Chip substrate comprising a plated layer and chip package using the same
POINT ENGINEERING CO LTD0 citations42
US9847462B2Dec 19, 2017
Array substrate for mounting chip and method for manufacturing the same
POINT ENGINEERING CO LTD0 citations40
US9653664B2May 16, 2017
Chip substrate comprising a groove portion and chip package using the chip substrate
POINT ENGINEERING CO LTD0 citations34