P

Inventor

NAM KI MYUNG

KR19 patents
⚠️ This page may combine multiple inventors who share the name “NAM KI MYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

POINT ENGINEERING CO LTD

17 patents
US9559268B2Jan 31, 2017

Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method

POINT ENGINEERING CO LTD3 citations73
US9281452B2Mar 8, 2016

Method for manufacturing a can package-type optical device, and optical device manufactured thereby

POINT ENGINEERING CO LTD2 citations62
US9018651B2Apr 28, 2015

Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereof

POINT ENGINEERING CO LTD2 citations62
US10008638B2Jun 26, 2018

Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method

POINT ENGINEERING CO LTD0 citations52
US9666558B2May 30, 2017

Substrate for mounting a chip and chip package using the substrate

POINT ENGINEERING CO LTD0 citations52
US9378986B2Jun 28, 2016

Method for mounting a chip and chip package

POINT ENGINEERING CO LTD1 citations52
US10062812B2Aug 28, 2018

Substrate for can package-type optical device and optical device using same

POINT ENGINEERING CO LTD0 citations51
US9374890B2Jun 21, 2016

Chip substrate having a lens insert

POINT ENGINEERING CO LTD1 citations51
US9666565B2May 30, 2017

Optical device and method for manufacturing same

POINT ENGINEERING CO LTD0 citations50
US9537074B2Jan 3, 2017

High heat-radiant optical device substrate

POINT ENGINEERING CO LTD0 citations50
US9316768B2Apr 19, 2016

Substrate for preventing burr generation

POINT ENGINEERING CO LTD0 citations50
US9287243B2Mar 15, 2016

Optical device and method for manufacturing same

POINT ENGINEERING CO LTD0 citations50
US9214453B2Dec 15, 2015

Optical device and method for manufacturing same

POINT ENGINEERING CO LTD0 citations50
US9818913B2Nov 14, 2017

Chip substrate

POINT ENGINEERING CO LTD0 citations42
US9595642B2Mar 14, 2017

Chip substrate comprising a plated layer and chip package using the same

POINT ENGINEERING CO LTD0 citations42
US9847462B2Dec 19, 2017

Array substrate for mounting chip and method for manufacturing the same

POINT ENGINEERING CO LTD0 citations40
US9653664B2May 16, 2017

Chip substrate comprising a groove portion and chip package using the chip substrate

POINT ENGINEERING CO LTD0 citations34

NAM KI MYUNG

2 patents