Inventor · disambiguated record
Mikinori Kawaji
Also filed as: KAWAJI MIKINORI
9 granted patents·1 pending application·523 citations·filing 1987–2002
92Inventor score
Files withHITACHI LTD9
Top patents by PatentIndex Score
10 records- 0192US5060045ASemiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1989·Granted Oct 22, 1991·80 cites·51 claims
- 0288US5027188ASemiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrateHITACHI LTD·Filed 1989·Granted Jun 25, 1991·91 cites·20 claims
- 0387US5117277ASemiconductor integrated circuit device with improved connection pattern of signal wiringsHITACHI LTD·Filed 1990·Granted May 26, 1992·132 cites·14 claims
- 0483US5220199ASemiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrateHITACHI LTD·Filed 1991·Granted Jun 15, 1993·85 cites·34 claims
- 0579US5306948ASemiconductor device and semiconductor module having auxiliary high power supplying terminalsHITACHI LTD·Filed 1992·Granted Apr 26, 1994·63 cites·25 claims
- 0664US5011788AProcess of manufacturing semiconductor integrated circuit device and product formed therebyHITACHI LTD·Filed 1988·Granted Apr 30, 1991·22 cites·21 claims
- 0758US4819054ASemiconductor IC with dual groove isolationHITACHI LTD·Filed 1987·Granted Apr 4, 1989·18 cites·30 claims
- 0851US5141888AProcess of manufacturing semiconductor integrated circuit device having trench and field isolation regionsHITACHI LTD·Filed 1991·Granted Aug 25, 1992·15 cites·37 claims
- 0943US5342480AMethod of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 1993·Granted Aug 30, 1994·17 cites·4 claims
- 1027US2003152873A1Fabrication method of semiconductor integrated circuit deviceFiled 2002·Application pending·0 cites
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