Inventor
BAYRAM CAN
US25 patents
⚠️ This page may combine multiple inventors who share the name “BAYRAM CAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS9059339B1Jun 16, 2015
Light emitting diodes with via contact scheme
IBM21 citations92
US8916451B2Dec 23, 2014
Thin film wafer transfer and structure for electronic devices
IBM29 citations92
US9608160B1Mar 28, 2017
Polarization free gallium nitride-based photonic devices on nanopatterned silicon
IBM19 citations84
US9331076B2May 3, 2016
Group III nitride integration with CMOS technology
IBM11 citations84
US9059075B2Jun 16, 2015
Selective gallium nitride regrowth on (100) silicon
IBM7 citations84
US9058990B1Jun 16, 2015
Controlled spalling of group III nitrides containing an embedded spall releasing plane
IBM8 citations84
US9048173B2Jun 2, 2015
Dual phase gallium nitride material formation on (100) silicon
IBM12 citations84
US10957816B2Mar 23, 2021
Thin film wafer transfer and structure for electronic devices
IBM2 citations73
US9660069B2May 23, 2017
Group III nitride integration with CMOS technology
IBM3 citations73
US9362281B2Jun 7, 2016
Group III nitride integration with CMOS technology
IBM3 citations73
US9099381B2Aug 4, 2015
Selective gallium nitride regrowth on (100) silicon
IBM2 citations63
US8927398B2Jan 6, 2015
Group III nitrides on nanopatterned substrates
IBM2 citations63
US9564526B2Feb 7, 2017
Group III nitride integration with CMOS technology
IBM1 citations62
US10056251B2Aug 21, 2018
Hetero-integration of III-N material on silicon
IBM0 citations52
US9865769B2Jan 9, 2018
Back contact LED through spalling
IBM0 citations52
US9601583B2Mar 21, 2017
Hetero-integration of III-N material on silicon
IBM0 citations52
US9245747B2Jan 26, 2016
Engineered base substrates for releasing III-V epitaxy through spalling
IBM1 citations52
US9053930B2Jun 9, 2015
Heterogeneous integration of group III nitride on silicon for advanced integrated circuits
IBM0 citations52
GLOBALFOUNDRIES INC
4 patentsUS9574287B2Feb 21, 2017
Gallium nitride material and device deposition on graphene terminated wafer and method of forming the same
GLOBALFOUNDRIES INC1 citations52
US9391144B2Jul 12, 2016
Selective gallium nitride regrowth on (100) silicon
GLOBALFOUNDRIES INC0 citations52
US9236251B2Jan 12, 2016
Heterogeneous integration of group III nitride on silicon for advanced integrated circuits
GLOBALFOUNDRIES INC0 citations52
US9236271B2Jan 12, 2016
Laser-initiated exfoliation of group III-nitride films and applications for layer transfer and patterning
GLOBALFOUNDRIES INC1 citations52
UNIV ILLINOIS
3 patentsUS10027086B2Jul 17, 2018
Maximizing cubic phase group III-nitride on patterned silicon
UNIV ILLINOIS8 citations83
US12412751B2Sep 9, 2025
Large area synthesis of cubic phase gallium nitride on silicon
UNIV ILLINOIS1 citations57
US10211328B2Feb 19, 2019
Normally-off cubic phase GaN (c-GaN) HEMT having a gate electrode dielectrically insulated from a c-AlGaN capping layer
UNIV ILLINOIS0 citations33