P

Inventor

JACOBS SCOTT L

US10 patents
⚠️ This page may combine multiple inventors who share the name “JACOBS SCOTT L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

6 patents
US4866507ASep 12, 1989

Module for packaging semiconductor integrated circuit chips on a base substrate

IBM148 citations98
US4811082AMar 7, 1989

High performance integrated circuit packaging structure

IBM649 citations98
US4817093AMar 28, 1989

Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure

IBM153 citations97
US4782008ANov 1, 1988

Plasma-resistant polymeric material, preparation thereof, and use thereof

IBM33 citations91
US4981909AJan 1, 1991

Plasma-resistant polymeric material, preparation thereof, and use thereof

IBM12 citations72
US4828964AMay 9, 1989

Polyimide formulation for forming a patterned film on a substrate

IBM7 citations67

MCNC

1 patent
US5325265AJun 28, 1994

High performance integrated circuit chip package

MCNC252 citations98

MOSAIC INC

1 patent
US5055907AOct 8, 1991

Extended integration semiconductor structure with wiring layers

MOSAIC INC332 citations96

VIRTUAL INTEGRATION INC

1 patent
US6294407B1Sep 25, 2001

Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same

VIRTUAL INTEGRATION INC125 citations95

POLYLITHICS INC

1 patent
US5192716AMar 9, 1993

Method of making a extended integration semiconductor structure

POLYLITHICS INC117 citations95