Inventor
ARMACOST MICHAEL D
US30 patents
⚠️ This page may combine multiple inventors who share the name “ARMACOST MICHAEL D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
14 patentsUS6780753B2Aug 24, 2004
Airgap for semiconductor devices
APPLIED MATERIALS INC126 citations96
US7115534B2Oct 3, 2006
Dielectric materials to prevent photoresist poisoning
APPLIED MATERIALS INC39 citations93
US7226853B2Jun 5, 2007
Method of forming a dual damascene structure utilizing a three layer hard mask structure
APPLIED MATERIALS INC51 citations92
US10770321B2Sep 8, 2020
Process kit erosion and service life prediction
APPLIED MATERIALS INC4 citations70
US10177018B2Jan 8, 2019
Process kit erosion and service life prediction
APPLIED MATERIALS INC4 citations70
US7572734B2Aug 11, 2009
Etch depth control for dual damascene fabrication process
APPLIED MATERIALS INC2 citations63
US12511407B2Dec 30, 2025
Methods and mechanisms for secure data sharing
APPLIED MATERIALS INC0 citations62
US12314340B2May 27, 2025
Anomaly detection from aggregate statistics using neural networks
APPLIED MATERIALS INC0 citations62
US11657122B2May 23, 2023
Anomaly detection from aggregate statistics using neural networks
APPLIED MATERIALS INC0 citations62
US11378426B2Jul 5, 2022
System and method for monitoring sensor linearity as part of a production process
APPLIED MATERIALS INC0 citations50
US10901407B2Jan 26, 2021
Semiconductor device search and classification
APPLIED MATERIALS INC0 citations50
US10541169B2Jan 21, 2020
Method and system for balancing the electrostatic chucking force on a substrate
APPLIED MATERIALS INC0 citations48
US10303812B2May 28, 2019
Topography prediction using system state information
APPLIED MATERIALS INC0 citations40
US7758763B2Jul 20, 2010
Plasma for resist removal and facet control of underlying features
APPLIED MATERIALS INC0 citations39
IBM
14 patentsUS6518112B2Feb 11, 2003
High performance, low power vertical integrated CMOS devices
IBM67 citations96
US6297531B2Oct 2, 2001
High performance, low power vertical integrated CMOS devices
IBM73 citations96
US5545581AAug 13, 1996
Plug strap process utilizing selective nitride and oxide etches
IBM71 citations96
US5521422AMay 28, 1996
Corner protected shallow trench isolation device
IBM89 citations96
US5811357ASep 22, 1998
Process of etching an oxide layer
IBM57 citations95
US6187412B1Feb 13, 2001
Silicon article having columns and method of making
IBM17 citations92
US5759867AJun 2, 1998
Method of making a disposable corner etch stop-spacer for borderless contacts
IBM23 citations92
US5618379AApr 8, 1997
Selective deposition process
IBM24 citations92
US6734096B2May 11, 2004
Fine-pitch device lithography using a sacrificial hardmask
IBM22 citations91
US5622596AApr 22, 1997
High density selective SiO2 :Si3 N4 etching using a stoichiometrically altered nitride etch stop
IBM23 citations91
US6207353B1Mar 27, 2001
Resist formulation which minimizes blistering during etching
IBM28 citations90
US6489005B1Dec 3, 2002
Method of making silicon article having columns
IBM6 citations73
US6750113B2Jun 15, 2004
Metal-insulator-metal capacitor in copper
IBM12 citations69
US6656375B1Dec 2, 2003
Selective nitride: oxide anisotropic etch process
IBM3 citations62