Inventor

CHUN DOSUNG

TH8 patents

⚠️ This page may combine multiple inventors who share the name “CHUN DOSUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AMKOR TECHNOLOGY INC

6 patents

US6762078B2Jul 13, 2004

Semiconductor package having semiconductor chip within central aperture of substrate

AMKOR TECHNOLOGY INC141 citations98

US6395578B1May 28, 2002

Semiconductor package and method for fabricating the same

AMKOR TECHNOLOGY INC346 citations98

US6501184B1Dec 31, 2002

Semiconductor package and method for manufacturing the same

AMKOR TECHNOLOGY INC58 citations95

US7061120B2Jun 13, 2006

Stackable semiconductor package having semiconductor chip within central through hole of substrate

AMKOR TECHNOLOGY INC33 citations92

US6830955B2Dec 14, 2004

Semiconductor package and method for manufacturing the same

AMKOR TECHNOLOGY INC20 citations92

US6512288B1Jan 28, 2003

Circuit board semiconductor package

AMKOR TECHNOLOGY INC16 citations82

ALPHATEC HOLDING COMPANY LTD

1 patent

US6525405B1Feb 25, 2003

Leadless semiconductor product packaging apparatus having a window lid and method for packaging

ALPHATEC HOLDING COMPANY LTD43 citations88

MILLENIUM MICROTECH CO LTD

1 patent

US6797541B2Sep 28, 2004

Leadless semiconductor product packaging apparatus having a window lid and method for packaging

MILLENIUM MICROTECH CO LTD15 citations78