Inventor

LAMSON MICHAEL A

US22 patents

⚠️ This page may combine multiple inventors who share the name “LAMSON MICHAEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAMSON MICHAEL A

TEXAS INSTRUMENTS INC

Integrated circuit device having bumped power supply buses over active surface areas and method of manufacture thereof

Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer

Ball grid array package

Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads

Differential pair geometry for integrated circuit chip packages

Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board

Differential pair geometry for integrated circuit chip packages

Method of measuring semiconductor lead inductance by changing the dielectric constant surrounding the lead

Low capacitance coupling wire bonded semiconductor device

Constant impedance routing for high performance integrated circuit packaging

Low pass filter integral with semiconductor package

System for electrically modeling an electronic structure and method of operation

Structure and method of high performance two layer ball grid array substrate

Low capacitance coupling wire bonded semiconductor device

Semiconductor package with conductor impedance selected during assembly

Semiconductor package with conductor impedance selected during assembly

Method and configuration for reducing electrical noise in integrated circuit devices

Wire bonded semiconductor device having low inductance and noise

Structure and method of high performance two layer ball grid array substrate

Structure and method of high performance two layer ball grid array substrate

HITACHI LTD

Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation

Packaged semiconductor device and a leadframe therefor