Inventor

Liang yu-min

TW85 patents

⚠️ This page may combine multiple inventors who share the name “Liang yu-min”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Liang yu-min

TAIWAN SEMICONDUCTOR MFG CO LTD

Redistribution structures in semiconductor packages and methods of forming same

Integrated fan-out package and manufacturing method thereof

Substrate design for semiconductor packages and method of forming same

Semiconductor package

Package-on-package structure with organic interposer

Protrusion bump pads for bond-on-trace processing

Protrusion bump pads for bond-on-trace processing

Substrate design with balanced metal and solder resist density

Package structures and methods for forming the same

Semiconductor structure and manufacturing method thereof

Substrate and package structure

Protrusion bump pads for bond-on-trace processing

Semiconductor package and manufacturing method thereof

Package structure and method of forming the same

Semiconductor packages and methods of forming the same

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor packages and methods of manufacturing the same

Package structure and fabricating method thereof

Planarization of semiconductor packages and structures resulting therefrom

Package structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Planarization of semiconductor packages and structures resulting therefrom

Semiconductor packages and methods of forming the same

Substrate and package structure

Protrusion bump pads for bond-on-trace processing

Protrusion bump pads for bond-on-trace processing

Protrusion bump pads for bond-on-trace processing

Semiconductor package

Electronic component and manufacturing method thereof

Semiconductor package and methods of fabricating a semiconductor package

Probe card substrate, substrate structure and method of fabricating the same

Die corner removal for underfill crack suppression in semiconductor die packaging

Substrate and package structure

Semiconductor packages and methods of forming the same

Semiconductor packages

Semiconductor devices and methods of manufacturing

Semiconductor structure and manufacturing method thereof

Substrate and package structure

Die corner removal for underfill crack suppression in semiconductor die packaging

Semiconductor structure and manufacturing method thereof

Semiconductor devices and methods of manufacturing

Substrate and package structure

Semiconductor packages and methods of manufacturing the same

Method for manufacturing semiconductor structure

TAIWAN SEMICONDUCTOR MFG

Pop joint through interposer

Protrusion bump pads for bond-on-trace processing

Substrate design with balanced metal and solder resist density