P

Inventor

CHEBI ROBERT P

US14 patents
⚠️ This page may combine multiple inventors who share the name “CHEBI ROBERT P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

4 patents
US8425682B2Apr 23, 2013

High strip rate downstream chamber

LAM RES CORP378 citations97
US8043434B2Oct 25, 2011

Method and apparatus for removing photoresist

LAM RES CORP8 citations83
US7083903B2Aug 1, 2006

Methods of etching photoresist on substrates

LAM RES CORP13 citations79
US7605063B2Oct 20, 2009

Photoresist stripping chamber and methods of etching photoresist on substrates

LAM RES CORP5 citations58

WINNICZEK JAROSLAW W

3 patents
US8598037B2Dec 3, 2013

Silicon etch with passivation using plasma enhanced oxidation

WINNICZEK JAROSLAW W7 citations82
US8173547B2May 8, 2012

Silicon etch with passivation using plasma enhanced oxidation

WINNICZEK JAROSLAW W8 citations82
US9018098B2Apr 28, 2015

Silicon etch with passivation using chemical vapor deposition

WINNICZEK JAROSLAW W3 citations61

OPTOKEY INC

2 patents
US9857307B2Jan 2, 2018

Elevated surface enhanced Raman spectroscopy resonator structures and method of making same

OPTOKEY INC2 citations68
US9719931B2Aug 1, 2017

Surface enhanced raman spectroscopy resonator structures and methods of making same

OPTOKEY INC4 citations68

CHEBI ROBERT P

2 patents
US9318341B2Apr 19, 2016

Methods for etching a substrate

CHEBI ROBERT P2 citations51
US8757178B2Jun 24, 2014

Method and apparatus for removing photoresist

CHEBI ROBERT P0 citations48

MOTOROLA INC

1 patent
US5451543ASep 19, 1995

Straight sidewall profile contact opening to underlying interconnect and method for making the same

MOTOROLA INC147 citations97

WANG ING-YANN

1 patent
US8298336B2Oct 30, 2012

High strip rate downstream chamber

WANG ING-YANN384 citations95

DIGITAL EQUIPMENT CORP

1 patent
US5279865AJan 18, 1994

High throughput interlevel dielectric gap filling process

DIGITAL EQUIPMENT CORP404 citations95