Inventor
LEE BYOUNG HWA
KR138 patents
⚠️ This page may combine multiple inventors who share the name “LEE BYOUNG HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
45 patentsUS7046500B2May 16, 2006
Laminated ceramic capacitor
SAMSUNG ELECTRO MECH61 citations95
US8351181B1Jan 8, 2013
Chip type laminated capacitor
SAMSUNG ELECTRO MECH35 citations94
US8351180B1Jan 8, 2013
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH22 citations93
US7630208B2Dec 8, 2009
Multilayer chip capacitor, circuit board apparatus having the capacitor, and circuit board
SAMSUNG ELECTRO MECH22 citations93
US7595973B1Sep 29, 2009
Multilayer chip capacitor and circuit board apparatus having the capacitor
SAMSUNG ELECTRO MECH26 citations93
US7183872B2Feb 27, 2007
Laminated balun transformer
SAMSUNG ELECTRO MECH26 citations93
US7688568B1Mar 30, 2010
Multilayer chip capacitor
SAMSUNG ELECTRO MECH30 citations92
US7092236B2Aug 15, 2006
Multilayer chip capacitor
SAMSUNG ELECTRO MECH36 citations92
US7035079B1Apr 25, 2006
Multilayered chip capacitor and multilayer chip capacitor array
SAMSUNG ELECTRO MECH34 citations92
US6940710B1Sep 6, 2005
Multilayered chip capacitor
SAMSUNG ELECTRO MECH52 citations92
US10347421B2Jul 9, 2019
Multilayer ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH8 citations84
US10236126B2Mar 19, 2019
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH4 citations84
US9984828B2May 29, 2018
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH5 citations84
US9893703B2Feb 13, 2018
Multilayer electronic component
SAMSUNG ELECTRO MECH8 citations84
US9843299B2Dec 12, 2017
Multilayer electronic component
SAMSUNG ELECTRO MECH8 citations84
US9793053B2Oct 17, 2017
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH5 citations84
US9653212B2May 16, 2017
Multilayer ceramic capacitor and board for mounting thereof
SAMSUNG ELECTRO MECH9 citations84
US9491847B2Nov 8, 2016
Multilayer ceramic electronic component and board having the same
SAMSUNG ELECTRO MECH8 citations84
US9439301B2Sep 6, 2016
Multilayered chip electronic component and board for mounting the same
SAMSUNG ELECTRO MECH8 citations84
US9370102B2Jun 14, 2016
Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component
SAMSUNG ELECTRO MECH8 citations84
US9288906B2Mar 15, 2016
Mounting circuit board of multilayer ceramic capacitor
SAMSUNG ELECTRO MECH13 citations84
US9087646B2Jul 21, 2015
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH7 citations84
US8804367B2Aug 12, 2014
Multilayer ceramic capacitor and board for mounting the same
SAMSUNG ELECTRO MECH13 citations84
US8385048B2Feb 26, 2013
Chip type laminated capacitor
SAMSUNG ELECTRO MECH5 citations84
US8373964B2Feb 12, 2013
Multi-layered ceramic capacitor
SAMSUNG ELECTRO MECH12 citations84
US8050012B2Nov 1, 2011
Multilayer chip capacitor and circuit board device including the same
SAMSUNG ELECTRO MECH8 citations84
US7990677B2Aug 2, 2011
Multilayer chip capacitor
SAMSUNG ELECTRO MECH7 citations84
US7961453B2Jun 14, 2011
Multilayer chip capacitor
SAMSUNG ELECTRO MECH9 citations84
US7920370B2Apr 5, 2011
Multilayer chip capacitor
SAMSUNG ELECTRO MECH7 citations84
US7675733B2Mar 9, 2010
Multilayer capacitor
SAMSUNG ELECTRO MECH10 citations84
US7599166B2Oct 6, 2009
Multilayer chip capacitor
SAMSUNG ELECTRO MECH15 citations84
US7567425B1Jul 28, 2009
Multilayer chip capacitor
SAMSUNG ELECTRO MECH14 citations84
US7502216B2Mar 10, 2009
Multilayer chip capacitor
SAMSUNG ELECTRO MECH14 citations84
US7262952B2Aug 28, 2007
Multilayer chip capacitor
SAMSUNG ELECTRO MECH16 citations84
US6914512B2Jul 5, 2005
3-line balun transformer
SAMSUNG ELECTRO MECH16 citations84
US9685272B2Jun 20, 2017
Multilayer ceramic capacitor having multilayer external electrodes and board having the same
SAMSUNG ELECTRO MECH8 citations83
US7149072B2Dec 12, 2006
Multilayered chip capacitor array
SAMSUNG ELECTRO MECH14 citations83
US7292430B2Nov 6, 2007
Multi-layer chip capacitor
SAMSUNG ELECTRO MECH17 citations82
US11342124B2May 24, 2022
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US10847320B2Nov 24, 2020
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US10622154B2Apr 14, 2020
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US9978522B2May 22, 2018
Multilayer ceramic capacitor and mounting board therefor
SAMSUNG ELECTRO MECH2 citations73
US9728334B2Aug 8, 2017
Multilayer ceramic capacitor and board for mounting thereof
SAMSUNG ELECTRO MECH2 citations73
US9627139B2Apr 18, 2017
Multilayered ceramic capacitor and board for mounting the same
SAMSUNG ELECTRO MECH3 citations73
US9543076B2Jan 10, 2017
Electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations73
LEE BYOUNG HWA
4 patentsUS8194389B2Jun 5, 2012
Multilayer chip capacitor including two terminals
LEE BYOUNG HWA11 citations84
US8184425B2May 22, 2012
Multilayer capacitor
LEE BYOUNG HWA12 citations84
US8159813B2Apr 17, 2012
Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network
LEE BYOUNG HWA9 citations84
US8149565B2Apr 3, 2012
Circuit board device and integrated circuit device
LEE BYOUNG HWA15 citations83
SUMITOMO ELECTRO MECHANICS CO
1 patentShowing the top 50 of 138 patents by PatentIndex Score.