Inventor
CHAE EUN HYUK
KR20 patents
⚠️ This page may combine multiple inventors who share the name “CHAE EUN HYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
18 patentsUS10347421B2Jul 9, 2019
Multilayer ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH8 citations84
US9974183B2May 15, 2018
Multilayer ceramic electronic component and board having the same
SAMSUNG ELECTRO MECH10 citations84
US9370102B2Jun 14, 2016
Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component
SAMSUNG ELECTRO MECH8 citations84
US8937801B2Jan 20, 2015
Array-type multilayered ceramic electronic component
SAMSUNG ELECTRO MECH2 citations63
US9258896B2Feb 9, 2016
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH2 citations62
US9105411B2Aug 11, 2015
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations62
US8902563B2Dec 2, 2014
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH2 citations62
US8953300B2Feb 10, 2015
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations61
US9230740B2Jan 5, 2016
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
SAMSUNG ELECTRO MECH1 citations52
US9226401B2Dec 29, 2015
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
SAMSUNG ELECTRO MECH1 citations52
US9424989B2Aug 23, 2016
Embedded multilayer ceramic electronic component and printed circuit board having the same
SAMSUNG ELECTRO MECH1 citations51
US9196421B2Nov 24, 2015
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations51
US9099250B2Aug 4, 2015
Multilayer ceramic capacitor to be embedded in board, method of manufacturing the same, and method of manufacturing board having multilayer ceramic capacitor embedded therein
SAMSUNG ELECTRO MECH1 citations51
US9396878B2Jul 19, 2016
Multilayer ceramic capacitor, manufacturing method therefor, circuit board having multilayer ceramic capacitor embedded therein, and polishing device for multilayer ceramic capacitor
SAMSUNG ELECTRO MECH1 citations44
US9196420B2Nov 24, 2015
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations42
US9287044B2Mar 15, 2016
Electronic component and fabrication method thereof
SAMSUNG ELECTRO MECH0 citations41
US9198297B2Nov 24, 2015
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
SAMSUNG ELECTRO MECH0 citations38
US9173294B2Oct 27, 2015
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations38