Inventor

PIPITONE JOHN

US20 patents

⚠️ This page may combine multiple inventors who share the name “PIPITONE JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PIPITONE JOHN

APPLIED MATERIALS INC

Physical vapor deposition plasma reactor with VHF source power applied through the workpiece

Apparatus for wafer level arc detection at an electrostatic chuck electrode

Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece

Method of multi-location ARC sensing with adaptive threshold comparison

Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece

Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation

Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas

Physical vapor deposition with isotropic neutral and non-isotropic ion velocity distribution at the wafer surface

Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece

System with multi-location arc threshold comparators and communication channels for carrying arc detection flags and threshold updating

Physical vapor deposition system with a source of isotropic ion velocity distribution at the wafer surface

Apparatus for wafer level arc detection at an RF bias impedance match to the pedestal electrode

HOFFMAN DANIEL J

Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target

Physical vapor deposition chamber with capacitive tuning at wafer support

Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surface

BROWN KARL M

Method of performing physical vapor deposition with RF plasma source power applied to the target using a magnetron

Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target

Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron

RITCHIE ALAN

Methods for depositing metal in high aspect ratio features

BROWN KARL

Methods for depositing metal in high aspect ratio features