Inventor

LANDRU DIDIER

FR58 patents

⚠️ This page may combine multiple inventors who share the name “LANDRU DIDIER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LANDRU DIDIER

SOITEC SILICON ON INSULATOR

Device for separating two substrates

Method for manufacturing a hybrid structure

Structure for radiofrequency applications

Substrate having a charged zone in an insulating buried layer

Method for transferring blocks from a donor substrate onto a receiver substrate by implanting ions in the donor substrate through a mask, bonding the donor substrate to the receiver substrate, and detaching the donor substrate along an embrittlement plane

Method for transferring blocks from a donor substrate onto a receiver substrate by implanting ions in the donor substrate through a mask, bonding the donor substrate to the receiver substrate, and detaching the donor substrate along an embrittlement plane

SOI substrates with a fine buried insulating layer

Hybrid structure and a method for manufacturing the same

Method of mechanical separation for a double layer transfer

System for fracturing a plurality of wafer assemblies

Hybrid structure and a method for manufacturing the same

Method of mechanical separation for a double layer transfer

Method for producing a donor substrate for creating a three-dimensional integrated structure, and method for producing such an integrated structure

Method of mechanical separation for a double layer transfer

Method for separating at least two substrates along a selected interface

Method for detecting the splitting of a substrate weakened by implanting atomic species

Substrates including useful layers

Process to dissolve the oxide layer in the peripheral ring of a structure of semiconductor-on-insulator type

Removable structure and removal method using the structure

Process for transferring a thin layer to a support substrate that have different thermal expansion coefficients

Holding device for an assembly that is to be fractured

Method for transferring a useful layer from a donor substrate onto a support substrate by applying a predetermined stress

Method for transferring a useful layer onto a support substrate

Process for smoothing the surface of a semiconductor-on-insulator substrate

Vertical furnace with device for trapping contaminants

Method for separating at least two substrates along a selected interface

Method for dissolving a silicon dioxide layer

Process for fabrication of a structure with a view to a subsequent separation

Method for dissolving a silicon dioxide layer

Process for smoothing the surface of a structure

Method for transferring a useful layer

Method for manufacturing a composite structure comprising a thin layer made of monocrystalline SiC on a carrier substrate made of SiC

Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiC

LANDRU DIDIER

Process for realizing a connecting structure

Method of producing a layer of cavities

Method of detaching semi-conductor layers at low temperature

Method for separating a layer from a composite structure

Method for producing a stack of semi-conductor thin films

Process for measuring an adhesion energy, and associated substrates

Process for treating a semiconductor-on-insulator structure

Electronic device for radiofrequency or power applications and process for manufacturing such a device

SADAKA MARIAM

Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods

Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods

COMMISSARIAT ENERGIE ATOMIQUE

Method for transferring a useful layer

Process for hydrophilically bonding substrates

SHAHEEN MOHAMAD

Substrate having a charged zone in an insulating buried layer

LETERTRE FABRICE

Process for fabricating a semiconductor structure employing a temporary bond

RIOU GREGORY

Method for manufacturing components

VEYTIZOU CHRISTELLE

Process for locally dissolving the oxide layer in a semiconductor-on-insulator type structure

COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Method for producing a semiconductor structure comprising an interface region including agglomerates