Inventor

GUEVARA GABRIEL Z

US25 patents

⚠️ This page may combine multiple inventors who share the name “GUEVARA GABRIEL Z”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GUEVARA GABRIEL Z

INVENSAS CORP

Anchoring structure of fine pitch bva

Deformable electrical contacts with conformable target pads

Warpage balancing in thin packages

Warpage balancing in thin packages

Multi-layer substrates suitable for interconnection between circuit modules

Wafer-level packaging using wire bond wires in place of a redistribution layer

Fan-out wafer-level packaging using metal foil lamination

Wafer level packages with mechanically decoupled fan-in and fan-out areas

Stretchable film assembly with conductive traces

Interconnection substrates for interconnection between circuit modules, and methods of manufacture

Interconnection substrates for interconnection between circuit modules, and methods of manufacture

Fan-out wafer-level packaging using metal foil lamination

Wafer-level packaging using wire bond wires in place of a redistribution layer

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Bonded structures with integrated passive component

Direct bonded stack structures for increased reliability and improved yield in microelectronics

Direct bonded stack structures for increased reliability and improved yield in microelectronics

Bonded structures with integrated passive component

Stacked electronic devices

XCELSIS CORP

Configurable smart object system with methods of making modules and contactors

Configurable smart object system with clip-based connectors

Configurable smart object system with magnetic contacts and magnetic assembly

INVENSAS BONDING TECH INC

Direct bonded stack structures for increased reliability and improved yield in microelectronics

ADEIA SEMICONDUCTOR TECH LLC

Stretchable film assembly with conductive traces

GUEVARA GABRIEL Z

Heat spreading substrate

MOHAMMED ILYAS

Heat spreading substrate