Inventor

DORDI YEZDI N

US22 patents

⚠️ This page may combine multiple inventors who share the name “DORDI YEZDI N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DORDI YEZDI N

APPLIED MATERIALS INC

Method and associated apparatus for tilting a substrate upon entry for metal deposition

Electric contact element for electrochemical deposition system and method

Perforated anode for uniform deposition of a metal layer

Flow diffuser to be used in electro-chemical plating system

Deposition uniformity control for electroplating apparatus, and associated method

Flow diffuser to be used in electro-chemical plating system and method

Reverse voltage bias for electro-chemical plating system and method

Integrated solder bump deposition apparatus and method

LAM RES CORP

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

Apparatus for plating semiconductor wafers

Proximity processing using controlled batch volume with an integrated proximity head

Metal liner passivation and adhesion enhancement by zinc doping

Method of etching an etch layer

Apparatus and method for plating semiconductor wafers

Metal liner passivation and adhesion enhancement by zinc doping

LSI LOGIC CORP

Tape ball grid array package with perforated metal stiffener

Reflow ball grid array assembly

DORDI YEZDI N

Methods of low-K dielectric and metal process integration

Electroless copper deposition

DIGITAL EQUIPMENT CORP

Paddleless molded plastic semiconductor chip package

WOODS CARL A

Proximity processing using controlled batch volume with an integrated proximity head